PCB Repairing
Zopper , Assurant
PCB Repairing
Delhi , NCR (India)
2025
Project Overview
Challenges
1. Identifying Faulty Components
(i) Some damaged components may not show visible signs of failure (e.g., micro-cracks, internal short circuits).
(ii) Requires advanced diagnostic tools like oscilloscopes and thermal cameras.
2. Sourcing Replacement Components
(i) Hard-to-find or obsolete components may delay repairs.
(ii) Compatibility issues if using alternative components.
3. Precision Soldering & Rework
(i) Small surface-mounted devices (SMDs) require high precision.
(ii) Risk of overheating or damaging adjacent components.
4. Multi-Layer PCB Complexity
(i) Repairing inner-layer traces is difficult without damaging other layers.
(ii) Requires specialized tools like BGA (Ball Grid Array) rework stations.
5. ESD (Electrostatic Discharge) Protection
(i) Sensitive components can get damaged during handling.(ii) Requires proper grounding and anti-static precautions.
6. Repair Time & Cost Efficiency
(i) Balance between repair costs and the feasibility of replacing the entire PCB.
(ii) Ensuring quick turnaround while maintaining quality.
Challenges
1. Identifying Hidden Circuit Board Damage
(i) PCBs can have microscopic cracks, delaminations, or burnt traces that are hard to detect.
(ii) Requires X-ray inspection or thermal imaging for better diagnosis.
2. Identifying Hidden Circuit Board Damage
(i) PCBs can have microscopic cracks, delaminations, or burnt traces that are hard to detect.
(ii) Requires X-ray inspection or thermal imaging for better diagnosis.
3. Handling Complex BGA & Microcontrollers
(i) Ball Grid Array (BGA) chips and microcontrollers need special rework stations.
(ii) Incorrect reflow temperatures can cause chip failure or misalignment.
4. Reverse Engineering Undocumented Circuits
(i) Some PCBs lack circuit diagrams or component details.
(ii) Requires deep technical expertise and testing to map out connections.
5. Dealing with Coating & Contaminants
(i) PCBs may have protective coatings (conformal coatings) that must be carefully removed before repair.
(ii) Dirt, oxidation, and corrosion can interfere with soldering and conductivity.
6.Ensuring Post-Repair Functionality
(i) Even after replacing faulty parts, latent defects may cause intermittent failures.
(ii) Requires thorough burn-in testing and stress testing.